Probing Solutions

Manual Probe System α200CS α300CS

Manual Probe System α200CS α300CS


Temperature characteristic evaluation from -60 °C to +350 °C

  • It is a Manual Probe System which supports wafer sizes of 8 inch and 12 inch respectively.
  • It has a compact shield to prevent dew condensation.
  • The compact shield provides a low noise environment.
  • With XY coarse movement and fine adjustment using micrometer that can be quickly positioned by air bearing design, reliable alignment is possible.
  • Z movement of the platen has coarse movement that can be operated with a lever, and fine movement that can be adjusted with micrometer.


  • Low level IV (fA)
  • Low level CV (fF)
  • Probe solution for high-power devices 20kV DC/200A
  • RF measurement
  • Various resistance measurements such as sheet resistance
  • Temperature characteristic test in high and low temperature environment
  • Reliability test such as TDDB


  • Thermal chuck from -60°C to +350°C
  • Triaxial connection to chuck
  • High-power chuck
  • Change to use CCD camera
  • Probe card (4 .5 inch square PCB)
  • Combination with various light sources

Optical System Selection

  • Stereomicroscope (default)
  • Trinocular microscope
  • Zoom micro CCD camera
  • Mitutoyo Finescope FS70Z series and FZ70L

Examples of measuring instruments to be connected

  • Device Analyzers/Parameter analyzers
  • Power Device Analyzer
  • Source Measure Units
  • Curve Tracers
  • Precision LCR meters
  • Digital multimeters
  • Impedance Analyzers
  • Network Analyzers
  • In addition, various measuring instruments of each company


α200CS α300CS
Wafer chuck size ~8inch ~12inch
Stage travel range (Coarse) X:200㎜ Y:200㎜ X:320㎜ Y:320㎜
Stage travel range (Fine) X:±12.5㎜ Y:±12.5㎜ X:±12.5㎜ Y:±12.5㎜
Stage θ travel ±5° ±4°
Z Stage travel 0ー0.3ー5㎜ 0ー0.3ー5㎜
Z Stage fine travel 10㎜ 10㎜
Dimensions W690×D780×H620㎜ W965×D930×H700㎜
Weight 80㎏ 165㎏