Overview
Temperature characteristic evaluation from -60°C to +350°C.
- It is a semi-automated probe systems which supports wafer sizes of 6 inch and 8 inch respectively.
- It has a compact shield to prevent dew condensation.
- The compact shield provides a low noise environment.
- Probe station equipped with APOLLOWAVE proprietary software realizes high test efficiency.
- By image recognition, automatic wafer alignment and automatic chip alignment are possible.
Applications
- Low level IV (fA)
- Low level CV (fF)
- Probe solution for high-power devices 20kV DC/200A
- RF measurement
- Various resistance measurements such as sheet resistance
- Temperature characteristic test in high and low temperature environment
- Reliability test such as TDDB
Options
- Thermal chuck from -60°C to +350°C
- Triaxial connection to chuck
- High-power chuck
- Automatic alignment by image recognition
- Probe card (4.5 inch square PCB)
Examples of measuring instruments to be connected
- Device Analyzers/Parameter analyzers
- Power Device Analyzer
- Source Measure Units
- Curve Tracers
- Precision LCR meters
- Digital multimeters
- Impedance Analyzers
- Network Analyzers
- In addition, various measuring instruments of each company
Specifications
| AP-200 | AP-300 | |
|---|---|---|
| Wafer chuck size | ～8inch | ～12inch |
| StageXY movement amount | X：220㎜ Y：400㎜ | X：320㎜ Y：500㎜ |
| StageXYZ control resolution | 0.1μm | 0.1μm |
| StageXYZ Reproducibility | ±2μm | ±3μm |
| Stage XY Accuracy | ±5μm | ±10μm |
| StageXY moving speed | 30㎜/sec(Max) | 25㎜/sec(Max) |
| StageZaxis movement amount | 30㎜ | 80㎜ |
| StageZaxis movement speed | 25㎜/sec(Max) | 25㎜/sec(Max) |
| Stage θ Stag travel | ±5deg | ±6deg |
| Stage θ resolution | 0.001deg | 0.000022294deg |
| Dimensions | W760×D1000×H1020㎜ | W880×D1260×H1030㎜ |
| Weight | 400kg | 800kg |
Gallery
