Probing Solutions

Semi-Auto Prober

Semi-Auto Prober


Temperature characteristic evaluation from -60°C to +350°C.

  • It is a semi-automated probe systems which supports wafer sizes of 6 inch and 8 inch respectively.
  • It has a compact shield to prevent dew condensation.
  • The compact shield provides a low noise environment.
  • Probe station equipped with APOLLOWAVE proprietary software realizes high test efficiency.
  • By image recognition, automatic wafer alignment and automatic chip alignment are possible.


  • Low level IV (fA)
  • Low level CV (fF)
  • Probe solution for high-power devices 20kV DC/200A
  • RF measurement
  • Various resistance measurements such as sheet resistance
  • Temperature characteristic test in high and low temperature environment
  • Reliability test such as TDDB


  • Thermal chuck from -60°C to +350°C
  • Triaxial connection to chuck
  • High-power chuck
  • Automatic alignment by image recognition
  • Probe card (4.5 inch square PCB)

Examples of measuring instruments to be connected

  • Device Analyzers/Parameter analyzers
  • Power Device Analyzer
  • Source Measure Units
  • Curve Tracers
  • Precision LCR meters
  • Digital multimeters
  • Impedance Analyzers
  • Network Analyzers
  • In addition, various measuring instruments of each company


AP-200 AP-300
Wafer chuck size ~8inch ~12inch
StageXY movement amount X:220㎜ Y:400㎜ X:320㎜ Y:500㎜
StageXYZ control resolution 0.1μm 0.1μm
StageXYZ Reproducibility ±2μm ±3μm
Stage XY Accuracy ±5μm ±10μm
StageXY moving speed 30㎜/sec(Max) 25㎜/sec(Max)
StageZaxis movement amount 30㎜ 80㎜
StageZaxis movement speed 25㎜/sec(Max) 25㎜/sec(Max)
Stage θ Stag travel ±5deg ±6deg
Stage θ resolution 0.001deg 0.000022294deg
Dimensions W760×D1000×H1020㎜ W880×D1260×H1030㎜
Weight 400kg 800kg